●Product description

3S Korea has enabled to respond a single model of FOSB to
chipmaker for the first time in Korea. Developed as a proprietary
product, it is now being delivered to domestic chip maker. Except
for some special process line, our FOSB can mostly cope with auto
and manual machine. In addition, top flange for OHT (overhead hoist
transporter) is available as an option.

●Specification

(Wafer storage quantity) : 25sheets

(Width) : 387.3mm

(Length) : 344.5mm

(Height) : 328mm

(Weight) : Empty - 4.2kg

With wafer - 7.2kg

●Product Compatibility

Secure compatibility of facility based on SEMI (E15.1, E62,
E63, E64, E110, E83, E84, E85, E99, E144) SPEC.

. Realize the compact system by inducing laminar f?low using corrugated inclined plate

. Pursue comprehensive economic eff?iciency for the purpose of area saving in the factory

having insuff?icient [and etc

. Micro-bubble of 30~50u m guarantees the quick and perfect f?lotation

. Concentration blade, whose percentage of water content is one third of other

similar system. is applied

. Screw auger blocks the recontamination of sedimatation sludge by eliminating

the sludge perfectly without being accumulated

. Minimize the maintenance cost and convenient management