●Product description

FOUP is used in the chip maker process and is a 300mm wafer
carrier box that is long-term operation, unlike the disposable FOSB.
Our FOUP is lightweight and ergonomically designed for user's
convenience and has high durability to minimize scratches. Besides,
it has a stable wafer holding capacity and gasket sealing structure
with high level of airtightness which enable us to minimize internal
particle generation and out gas generation as well. By using an
electro-conductive material, we have blocked the particle absorption.